Conformable bioelectronic interfaces: Mapping the road ahead

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Science Translational Medicine  31 Jul 2019:
Vol. 11, Issue 503, eaaw5858
DOI: 10.1126/scitranslmed.aaw5858


  • Table 1 Innovative strategies address challenges in developing next-generation conformable and implantable bioelectronic interfaces.

    Conformable microfabricationHermetic encapsulationSystem-level integrationRegulatory adaptation
    Manufacturing standards for thin-film
    devices on conformable carrier
    Multilayered stacks of polymer/
    inorganic barriers
    Compact wireless transmission
    Policy changes for approval of
    tailor-made medical devices
    Hybrid integration of rigid
    complementary metal-oxide-
    semiconductor (CMOS) components
    and polymer-based transducers
    Deposition processes, interface, and
    barrier properties of inorganic films
    such as silicon carbide (SiC) and
    hafnium oxide (HfO2)
    Power management (new battery
    technology, battery life/heating)
    New mechanical norms for
    conformable devices
    Fabrication of soft active electronic
    components (diodes, transistors,
    light-emitting diodes, and
    combinations thereof)
    Implantable plug-and-play
    Complete kits including tools for
    clinical use

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